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ROHM Forms Semiconductor Manufacturing Partnership in India

Collaboration with Suchi Semicon targets local packaging and back-end processing of power devices and ICs to strengthen supply chain resilience for global markets.

  www.rohm.com
ROHM Forms Semiconductor Manufacturing Partnership in India
During a ceremony, Ashok Mehta (l.), Chairman at Suchi Semicon and Makoto Terada, Managing Director at ROHM Semiconductor India, celebrated the start of their strategic semiconductor manufacturing partnership in India.

The semiconductor industry continues to diversify manufacturing locations to improve supply chain resilience and support regional electronics ecosystems. Expanding packaging and back-end capabilities in emerging semiconductor hubs has become a key strategy for device manufacturers. In this context, ROHM Co., Ltd. has established a strategic semiconductor manufacturing partnership with Suchi Semicon Pvt. Ltd. in India.

Expanding Semiconductor Manufacturing in India
The collaboration focuses on strengthening semiconductor manufacturing capabilities in India while serving both domestic demand and global supply chains. The initiative aligns with the country’s “Make in India” objective, which promotes local manufacturing across key technology sectors.

The partnership combines ROHM’s expertise in semiconductor device technology with Suchi Semicon’s manufacturing infrastructure and operational capabilities. The companies aim to develop a scalable production framework that can support industry growth while maintaining established manufacturing standards.

For semiconductor suppliers, distributed manufacturing and packaging capacity are increasingly important in managing geopolitical risks, logistics disruptions, and rising demand for electronic components.

Back-End Processing for Power Devices and IC Products
As part of the collaboration, ROHM is evaluating the outsourcing of back-end processes for selected power devices and integrated circuits (ICs) to Suchi Semicon. Back-end semiconductor manufacturing typically includes wafer dicing, chip packaging, and electrical testing, which are critical steps before devices are shipped to customers.

Technical evaluations for these activities are underway with the goal of enabling mass production shipments starting in 2026. Through this process, the companies intend to establish an early-stage semiconductor manufacturing framework in India capable of supporting the anticipated increase in device demand over the coming years.

Local Packaging Capabilities and Market Development
ROHM and Suchi Semicon also plan to develop a shared roadmap to expand the range of semiconductor packages manufactured locally. Increasing packaging capabilities in India would broaden the scope of collaboration between the two companies while supporting regional semiconductor supply chains.

Beyond manufacturing activities, the partnership includes cooperation in market development and customer engagement within India. Demand for locally manufactured semiconductors has been increasing across sectors such as automotive electronics, industrial equipment, and power management systems.

Suchi Semicon’s local market presence and marketing capabilities will support joint initiatives aimed at expanding visibility and business opportunities for semiconductor products manufactured through the collaboration.

The companies intend to expand the partnership over time, exploring additional areas of cooperation as India’s semiconductor ecosystem continues to develop.

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